DMN21D2UFB
1.0
1.4
1.3
0.8
0.6
0.4
0.2
V GS = 2.5 V
I D = 250mA
V GS = 4.5V
I D = 500mA
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
I D = 250μA
I D = 1mA
0
-50
-25 0 25 50 75 100 125 150
T J , JUNCTION TEMPERATURE ( ° C)
0
-50
-25 0 25 50 75 100 125 150
T J , JUNCTION TEMPERATURE ( ° C)
1.0
0.9
0.8
0.7
0.6
Fig. 7 On-Resistance Variation with Temperature
Fig. 8 Gate Threshold Variation vs. Ambient Temperature
100
C iss
0.5
0.4
T A = 150°C
10
0.3
T A = 125°C
T A = 85°C
C oss
0.2
0.1
0
T A = 25°C
T A = -55°C
1
f = 1MHz
C rss
0
0.2 0.4 0.6 0.8 1.0
1.2
0
2
4 6 8 10 12 14 16 18 20
10
V SD , SOURCE-DRAIN VOLTAGE (V)
Fig. 9 Diode Forward Voltage vs. Current
10
V DS , DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Typical Junction Capacitance
8
V DS = 10V
I D = 250m A
1
R DS(on)
Limited
6
4
0.1
DC
P W = 10s
P W = 1s
P W = 100ms
P W = 10ms
P W = 1ms
2
0.01 T J(max) = 150°C
T A = 25°C
V GS = 8V
Single Pulse
P W = 100μs
0
0
0.2 0.4 0.6 0.8
1.0
0.001 DUT on 1 * MRP Board
0.1 1 10
100
Q g , TOTAL GATE CHARGE (nC)
Fig. 11 Gate Charge
V DS , DRAIN-SOURCE VOLTAGE (V)
Fig. 12 SOA, Safe Operation Area
DMN21D2UFB
Document number: DS35564 Rev. 5 - 2
4 of 6
www.diodes.com
May 2012
? Diodes Incorporated
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